ASAP Semiconductor

Integrated Device Technology Inc

258-0146-010

Inclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Inclosure Material: Ceramic

Specifications

Part Number258-0146-010
DescriptionInclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Inclosure Material: Ceramic
ManufacturerIntegrated Device Technology Inc
NSN5962-01-358-4221(5962013584221)
Item NameInclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Inclosure Material: Ceramic
CAGE Code61772
NIIN01-358-4221(013584221)
FSC Code5962 Microcircuits Electronic
FSG Code59 Electrical and Electronic Equipment Components
NCB Code01
CountryUSA

Description

Inclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Inclosure Material: Ceramic

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Part Information

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NSN Information for Part Number 258-0146-010 with NSN 5962-01-358-4221, 5962013584221

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962013584221

Item Description:

MICROCIRCUIT,MEMORY

59620135842210NB
CIICHCCESDPMICCriticalityENAC
7BA0
Part NumberISCRNVCRNCCHCCMSDSSADC
P4C198A-45CMB523

Characteristics Data of NSN 5962-01-358-4221, 5962013584221

MRCCriteriaCharacteristic
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
AGAVEND ITEM IDENTIFICATIONMILSTAR
CQSJINCLOSURE MATERIALCERAMIC
CQSZINCLOSURE CONFIGURATIONDUAL-IN-LINE
CRTLCRITICALITY CODE JUSTIFICATIONFEAT
CXCYPART NAME ASSIGNED BY CONTROLLING AGENCYMCKT,DIGITAL,MEMORY
CZERMEMORY DEVICE TYPEROM
FEATSPECIAL FEATURESRADIATION HARDENED IAW ESD-82-TE-1390B;ESD;HCI;SH
TTQYTERMINAL TYPE AND QUANTITY24 FLAT LEADS
CQWXOUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM TOTAL SUPPLY